半導体プロセス(1)
Summary
TLDRこのビデオスクリプトでは、集積回路が電子業界を劇的に変革し、私たちの社会に不可欠な部分となっています。コンピュータなどの高度な電子機器に広く使用されており、日常生活に欠かせないものとなっています。ビデオでは、頭の動きでマウスカーソルを動かしたり、音声で操作を行う技術など、研究開発を通じて私たちの生活の質を向上させるコンピュータの使用例が紹介されています。また、集積回路がどのように作られるかについても、純粋なシリコン結晶の成長から始まり、ドープの追加など技術的な詳細を説明しています。
Takeaways
- 🎵 スクリプトには音楽と拍手の効果音が多数含まれている。
- 🌐 インテグレーテッド回路は電子産業を劇的に変え、私たちの社会に不可欠な部分となっています。
- 💻 コンピュータは日常生活に欠かせない高度な電子機器として使用されており、研究開発にも広く用いられています。
- 🚀 現代の電子時代は、数千のトランジスタやその他の電気部品が小さな結晶材料に集約されたときに始まりました。
- 🔬 コンピュータの中には、情報を記憶したり、毎秒何億回もの操作を実行できる小さなデバイスが並べられています。
- 🌟 シリコンクリスタルの成長から始まるインテグレーテッド回路の製造は、技術的な中心地であるシリコンバレーで行われています。
- 💠 純粋なシリコン結晶の成長には、砂から精製された純粋なシリコンが使用され、単結晶の種を用いて成長させられます。
- 🔩 ドープ剤を加えることで、シリコン結晶の電導性を調整し、半導体として機能する材料となります。
- 🛠️ ウォファーは研磨され、平坦で厚みが一定になるようにし、化学処理によって表面の汚れを除去します。
- 🔍 回路設計には、コンピュータ支援設計やコンピュータ支援工学のようなソフトウェアとハードウェアツールが使用されます。
- 🏭 CMOS製造プロセスは、数百の個別の操作を含み、数週間かかることもありますが、汚染の管理が非常に重要です。
Q & A
集積回路はどのようなもので、なぜ重要なのですか?
-集積回路は電子部品を集約した回路であり、電子業界を変えた重要な発明です。コンピュータや高度な電子機器に使用され、私たちの日常生活に欠かせない部分となっています。
集積回路が発展するにつれてどのような変化がありましたか?
-集積回路は元々は大きな真空管やトランジスタから発展し、現在では数百ミリオンものトランジスタを持ち、マイクロ電子、通信、コンピュータ業界の中心となっています。
純粋なシリコン結晶がどのように作られますか?
-砂からのシリコンを精製し、多結晶として純粋化します。その後、溶けたシリコンに種を下ろし、回転しながら新しい結晶が形成されます。
ドーパントとは何で、どのような種類がありますか?
-ドーパントはシリコン結晶に加えられた不純物で、電気伝導性を高める役割を果たします。n型ドーパントは砒素やリン、p型ドーパントは硼などがあります。
集積回路の製造にはどのような工程が必要ですか?
-集積回路の製造には、シリコン結晶の成長、ウォーファーの加工、回路設計、マスクの作成、電子ビーム装置でのパターンの転写、および多段のマスクを使用したトランジスタの形成などが必要です。
コンピュータ内で集積回路はどのように機能しますか?
-コンピュータ内の集積回路は情報を記憶したり、何億もの操作を1秒間に実行することができます。
CMOSトランジスタとはどのようなもので、どのように機能しますか?
-CMOSトランジスタは、nチャンネルとpチャンネルのトランジスタを組み合わせたもので、電気信号のスイッチとして機能します。小さな電圧を適用することでオンオフを制御します。
回路設計において、コンピュータ支援設計とコンピュータ支援工学はどのような役割を果たしますか?
-回路設計では、これらのツールを使用して回路の正確性をチェックし、エラーを特定し、回路の設計を最適化します。
マスク設計とは何であり、その重要性はどの程度ですか?
-マスク設計は、回路の設計をもとにマスクのレイアウトを作成するプロセスで、回路パターンをウォーファーに転写する際に不可欠です。
集積回路の製造において、汚染の管理はなぜ重要ですか?
-汚染の管理は、効果的な半導体デバイスの生産において非常に重要で、微細なほこりが生産効率を大幅に低下させる可能性があります。
CMOS製造プロセスにおける基本的技術には何が含まれますか?
-CMOS製造プロセスには、二酸化シリコンの薄層形成、ドープ原子の導入、絶縁材や導電材の堆積、そしてこれらの層の精密なパターン化が含まれます。
Outlines
🌐 集積回路と電子業界の進化
集積回路は電子業界を劇的に変革し、私たちの社会に不可欠な部分となっています。コンピュータをはじめとした高度な電子機器に広く使用されており、日常生活に密接に関わっています。集積回路は小さなクリスタリン状の物質に数千ものトランジスタやその他の電気部品を統合することで、現代のチップには数百万个のトランジスタが含まれ、マイクロ電子工学、通信、コンピュータ業界の中心となっています。コンピュータの中核となる集積回路は、昔の大きな真空管やトランジスタから進化し、シリコンバレーのような技術的センターで製造されています。シリコンクリスタルの成長から始まり、砂からの純粋なシリコンの精製、単結晶の形成、そして原子構造の詳細についても触れています。
🔬 半導体の基礎とドーパントの役割
この段落では、半導体の基礎とドーパントの追加による電気传导性の増加について説明しています。自由電子や空き(電子が抜けた場所)が電流を運ぶ仕組みと、n型ドープとp型ドープがどのようにして半導体を作り、電気的特徴を持たせているかが解説されています。n型ドープは砒素やリンなど、シリコンよりも1つの価電子を持つ元素であり、p型ドープは硼など、シリコンよりも1つの価電子が少ない元素です。これらのドープを用いてn型とp型の半導体が作られ、電気フィールドに応じて自由電子や空きが移動し、電流を導くことが可能になります。
🛠️ 集積回路の設計と製造プロセス
集積回路の設計と製造プロセスがこの段落で詳述されています。設計チームはコンピュータアーキテクトから始まり、ロジックデザイナー、回路デザイナーへと細分化され、マイクロプロセッサの次世代を設計しています。トランジスタの働きやCMOS(補完型金属酸化物半導体)トランジスタの仕組みについても説明されており、電気信号がどのようにスイッチを介して伝播するかも解説されています。回路設計には、コンピュータ支援設計(CAD)やコンピュータ支援工学(CAE)のようなソフトウェアとハードウェアツールが使用され、マスクデザイナーが回路の青写真を作り、電子ビーム装置によってマスクにパターンが転写されるプロセスが紹介されています。
🔍 集積回路の製造工程とマスクの使用
この段落では、集積回路の製造工程とマスクの使用について詳しく説明しています。製造には多岐にわたる工程があり、何百もの個別の操作が繰り広げられ、数週間を要する場合もあります。コンタミネーションの管理が非常に重要で、純粋な状態を保つ必要があります。p型ウエーファーの選択から始まり、シリコンジオキサイドの層の形成、ドープ原子の導入、様々な絶縁材や導電材の堆積、そして各層の精密なパターン作りが行われます。フォトリシストという感光材料を使用して、マスクのパターンがウエーファーに転写されるフォトリトグラフィー技術も紹介されています。
🧪 フォトリシストの使用と製造プロセスの開始
最後の段落では、フォトリシストを使用した製造プロセスの開始について説明しています。フォトリシストは光に敏感な樹脂溶解物質で、ウエーファーの表面に均等地塗布され、熱プレートで加熱して溶剂を蒸发させます。このプロセスは、マスクを使用してウエーファーにパターンを転写するフォトリトグラフィー技術の一部であり、集積回路の製造において重要な役割を果たしています。
Mindmap
Keywords
💡集積回路
💡半導体
💡トランジスタ
💡ドープ
💡CMOS
💡ウアフラー
💡光錐
💡設計チーム
💡製造プロセス
💡精度
Highlights
Integrated circuits have drastically changed the electronics industry and are integral to society.
Computers with integrated circuits are used in research and development to improve life quality.
Modern electronic era began with the integration of thousands of transistors on a small slice of crystalline material.
Today's chips contain millions of transistors and are central to microelectronics, communications, and computer industries.
Integrated circuits evolved from bulky vacuum tubes and transistors and are fabricated in technological centers like Silicon Valley.
Silicon, the common element found in sand, is refined and used to create pure silicon crystals for integrated circuits.
Silicon's cubic atomic structure allows for the growth of single crystals used in integrated circuits.
Conductivity of silicon can be increased by adding impurities called dopants.
Dopants like arsenic or phosphorus create n-type silicon, while boron creates p-type silicon.
Free electrons and holes in silicon conduct electrical current in response to applied electrical fields.
Silicon's ability to be a poor or good conductor makes it a semiconductor.
The ingot is sawed into thin wafers, which are then ground and polished to ensure uniformity and cleanliness.
Engineers design circuits that will be fabricated on the wafer surface, often requiring over 100 specialists for a microprocessor.
Transistors are microscopic switches that turn on and off hundreds of millions of times per second.
CMOS complementary metal-oxide-semiconductor transistors are created using n-type and p-type silicon regions.
Transistors amplify signals or represent digital information as a zero or one, forming the basis of modern electronic communications.
Designing circuits requires software and hardware tools, including computer-aided design and engineering.
Masks are used to transfer circuit patterns onto the wafer through a series of steps in the CMOS fabrication process.
Control of contamination is crucial in the fabrication process, as dust particles can drastically reduce the yield of semiconductor devices.
The fabrication process involves hundreds of individual operations and may take several weeks to complete.
Transcripts
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[Applause]
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integrated circuits have drastically
changed the electronics industry and
have become an integral part of our
society okay they are used in
sophisticated electronics and computers
which are part of our everyday lives
[Music]
[Music]
hi I'm not here now but leave me a
message and I'll get back in touch hello
comma my name is my name I'm using head
movements to move the mouse cursor
around and speech to do all my hands
words and commands these computers are
used extensively in research and
development to improve the quality of
our lives
Wisconsin wake up press but period go to
sleep
the modern electronic era bloomed when
thousands of transistors and other
electrical components were integrated on
a small slice of crystalline material
today's chips contain millions of
transistors and are the heart of the
micro electronics communications and
computer industries
[Music]
inside a computer there are rows of
these tiny devices each one capable of
storing information or executing
hundreds of millions of operations a
second
integrated circuits have evolved from
bulky vacuum tubes and transistors and
are fabricated in technological centers
like Silicon Valley
it all begins with the growth of pure
silicon crystals silicon is the common
element found in sand it is 28% of the
Earth's crust and second only to oxygen
in abundance the silicon from the sand
is refined and purified as polysilicon
chunks the purified silicon is then
heated to a molten State
a small solid piece of single crystal
called a seed is gently lowered into a
rotating vat of molten silicon using the
cubic atomic structure of the seed as a
pattern a new crystal will form as the
symmetrical extension of the original
seed
the hot liquid silicon in contact with
the seed begins to cool and solidify as
it is gently pulled from the molten
region
the cubic atomic structure of silicon
consists of atoms with four electrons in
their outermost shell in a perfect
crystal and at low temperatures each
silicon atom bonds with its four
neighbors there are no free electrons to
conduct current at room temperature
however the silicon crystal has enough
thermal energy to free a small number of
electrons these free electrons conduct
current as do the holes where the
electrons have been this conductivity
can be increased by adding impurities
called dopants
dopants are elements which are similar
to silicon in atomic structure there are
two types of dopants n-type dopants like
arsenic or phosphorus have one more
valence electron than silicon p-type
dopants like boron have one less when
some silicon atoms are replaced by
arsenic or phosphorus the crystal is
called n-type due to the extra electrons
are negatively charged free carriers
if boron is used the missing electron
behaves very much like a positive
carrier the crystal is called p-type
these free electrons and holes move
through the crystal conducting
electrical current in response to
applied electrical fields
after 48 hours of growth a single
crystal results from the liquid melt
the ability of Silicon to be either a
poor or a good conductor by fine control
of doping concentration make silicon a
member of a class of materials known as
semiconductors
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[Applause]
the shiny rippled surface of the crystal
is ground to form smooth uniform ingots
a curved diamond edge blade saws the
ingot into wafers that are as thin as
possible without being too fragile and
difficult to handle
the wafers are scrubbed and the edges
are rounded off and beveled to reduce
chipping the wafers are then ground
smooth on both sides to obtain a
consistent flatness and thickness from
wafer to wafer
[Applause]
they are rinsed and etched in chemicals
to remove surface contamination the
final polish is done on only one side of
the wafer
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the characteristic mirror-like luster is
free from scratches and contamination
the waivers are measured for resistivity
which is a function of dopant
concentration
they are inspected packaged and sent to
fabrication areas where they will be
made into integrated circuits meanwhile
teams of engineers work together to
design circuits that will be fabricated
on the wafer surface in this facility
over 100 specialists are often required
to design the next generation of a
microprocessor the organization of a
design team corresponds to the
organization of a completed chip right
now our eye caches is like 32 K solicit
lease offer them an option which
computer architects working at the
highest level of abstraction define the
overall function of the chip they
establish the microarchitecture which
regulates the timing and sequences of
instructions that tell a microprocessor
what to do
the design is divided into areas that
perform specific functions each unit is
assigned a logic designer who works at
the logic level to create more detailed
specifications and establish hardware
needs each unit is further subdivided
into functional blocks each block is
assigned to a circuit designer who works
at the transistor level the design
becomes a maze of interconnected
microscopic switches known as
transistors these transistors turn on
and off hundreds of millions of times
per second and in the process either
amplify incoming electrical signals or
represent this information as a digital
zero or one these two states make up the
code used in modern electronic
communications they are the logic or
language that computers understand and
translate into useful operations
to see how transistors work let's
examine a pair of CMOS complementary
metal-oxide-semiconductor transistors
the n-channel transistor has too heavily
doped electron-rich n-type regions
separated by an electron poor p-type
substrate the electron rich regions
called the source and drain become the
ends of an electronic switch which is
normally off the gate electrode is close
to but electrically isolated from the
p-type region the application of a small
positive voltage creates a net positive
charge on the gate
this charge attracts electrons from the
drain and source regions turning the
switch on when the gate voltage returns
to zero the transistor is again off in
the normally off p channel transistor
heavily doped p-type regions are
separated by a lightly doped n-type
substrate the application of a small
negative voltage repels electrons but
attracts the positive carriers turning
the switch on it is possible to
fabricate both P and N channel
transistors on the same wafer by doping
sections of the wafer this is known as
complementary MOS because a gate voltage
which turns a p-channel transistor on
turns an N channel transistor off to
illustrate this complementary switching
a top view shows current flowing through
the P channel transistor in the upper
left a voltage signal entering the gate
electrode turns on the complementary end
channel transistor allowing charges to
drain through this opens the lower set
of P channel transistors so the current
flows through them in this way
electrical signals can rapidly propagate
through a complex maze of switches
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designing these circuits requires
software and hardware tools like
computer aided design and computer aided
engineering after circuit designers
complete each block of circuitry the
computer checks for accuracy based on
geometrical and electrical design rules
a mask designer takes the circuit
schematic and manually lays out the
channels in each layer of the mask and
generates a master blueprint these
drawings are usually four or 500 times
the actual size of the chip and enable
engineers to visually check for errors
this information is electronically fed
into a computer controlled electron beam
machine
in an ultra clean environment a fine
electron beam will etch the patterns
onto a series of chrome-plated glass
plates
after the glass plates are etched they
become the masks that are used to
transfer the circuit patterns onto the
wafer each mask is inspected to ensure
the patterns are good the masks undergo
a final wash in acids before they are
carefully packaged the following
simplified sequence shows how masks are
used to build transistors step-by-step
the first mask creates a well of doping
so that the neighboring n-type and
p-type substrates exist on the same
wafer the P and n channel regions are
specified and electrically isolated by
the growth of silicon dioxide next the
gate electrodes which turn the
transistors on and off are formed masks
number four and five to find the source
and drain regions of the n-channel and
p-channel transistors the next mask
defines the contact holes which will
enable the aluminum wiring used to
interconnect the individual transistors
to contact the source drain and gate
region of each transistor most
integrated circuits use from 12 to 25
masks depending on the complexity of the
circuit and the type of process
and now let's go into a research
laboratory and follow a very simplified
version of a CMOS fabrication process
from start to finish a complex process
may involve hundreds of individual
operations and may take a number of
weeks to complete
to have a successful run control of
contamination is extremely important
it takes just a few microscopic dust
particles to drastically reduce the
yield of effective semiconductor devices
the equipment gases and chemicals that
come in contact with the silicon wafers
must also be of the highest purity and
free of contamination
to start CMOS fabrication p-type wafers
with a specific resistance are selected
all types of integrated circuits
including CMOS are fabricated using four
basic techniques formation of thin
layers of silicon dioxide introduction
of dopant atoms deposition of a variety
of insulating and conductive materials
and precision patterning of each of
these layers before the process begins
the laser scribed identification number
of each wafer is recorded
we start by cleaning the wafers in hot
acids hydrochloric acid sulfuric acid
hydrogen peroxide ammonium hydroxide
that's what it takes to remove all the
organic and metal contaminants
this cleaning procedure is repeated
throughout the process to make sure the
surface of the wafer stay absolutely
clean the wafers are rinsed in deionized
water and spun dry in filtered nitrogen
gas
in a vertical furnace high temperatures
will be used to grow a layer of silicon
dioxide silicon dioxide is a glass-like
insulator which protects the silicon
substrate beneath it
from unwanted reactions
[Music]
pure oxygen reacts with the silicon
surface in a hot furnace to grow a thin
layer of silicon dioxide this process is
similar to the way the sun's heat and
the airs oxygen turned the shiny new
paintjob of a car to a dull coat over
the years the silicon dioxide layer will
be etched and used as a stencil to dope
specific regions of the wafer
but first the pattern for the stencil is
applied to the silicon dioxide through a
photographic technique called
photolithography the first mask pattern
will be transferred onto the wafer using
photoresist a material which is
sensitive to light
in slow motion we can see the thick
photoresist which is a resin dissolved
in solvents evenly spread over the
surface the wafers transfer to heating
plates and bake at low temperatures to
evaporate
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