Intel's Crazy Plan for AI Chips IS WORKING! (Supercut)

Summary

Intel CEO Pat Gelsinger outlines the company's bold vision to become the world's leading chip manufacturer and foundry. He announces major advancements like the Intel 18A and 14A processes, extending Moore's Law into the angstrom era, as well as partnerships with Microsoft and Arm. Other Intel leaders then detail plans to revolutionize the foundry business through advanced 3D packaging to enable new 'systems of chips', immersion cooling, and other innovations to pave the way for ubiquitous AI while addressing sustainability.

Takeaways

• 😊 Intel is investing heavily in AI compute, energy and data centers to meet demand for AI services
• 😎 Intel believes AI will be one of the greatest tools invented, enabling abundant intelligence
• 😏 Intel encourages cautious optimism about AI to ensure responsible development
• 🤓 Intel is focused on delivering 5 leading edge nodes in 4 years to regain process leadership
• 👷‍♂️ Intel aims to become the #2 semiconductor foundry in the world
• 🌎 Intel wants to build the world's most resilient and sustainable foundry supply chain
• 🚀 Intel is venturing into the angstrom era with new transistor architectures
• 📈 Intel is expanding and enhancing its process nodes roadmap to ensure customer access
• 🔌 Intel offers advanced assembly, test and packaging technologies for AI systems
• ✨ Intel aims to optimize systems-on-chip and build interconnected systems-of-chips for AI

Q & A

What is the main purpose of Intel Foundry Services?

The main purpose is to establish Intel as a leading foundry provider that can enable the development of advanced semiconductors and help build resilient, sustainable, and trusted supply chains.

Why does the industry need more 'resilient' supply chains?

Because currently 80% of semiconductors are produced in a small, concentrated area in Asia. This centralization creates risks, so there is a need for more geographically distributed capacity to improve resilience.

What is 'angstrom era' referring to?

The angstrom era refers to the next generation of process nodes that measure features in the atomic-scale range of angstroms (less than 1 nanometer), including Intel nodes 20A and 18A.

How will new transistor architectures benefit computing?

The new transistor architectures like 'ribbonFET' will enable faster, more efficient computing at the atomic scale to power things like AI and advanced workloads.

Why is advanced packaging becoming so important?

Because monolithic chips are hitting limitations in terms of yield, cost and thermal constraints. Advanced multi-chip packaging allows for greater flexibility and performance by combining different chips/chiplets.

What is the 'UCIe' interconnect Intel mentioned?

UCIe is an open chiplet-to-chiplet interconnect standard Intel introduced, aiming to provide high-speed connectivity comparable to a PCI Express-like interface for multi-chip packages.

How will Intel Foundry Services help enable more efficient AI systems?

By developing advanced packaging, cooling, memory and interconnect solutions tailored for AI workloads that allow customers to build lower cost and more power efficient systems of chips.

Why did Intel partner with Arm?

Because Arm CPU and GPU IP is ubiquitous in the semiconductor industry. The partnership helps provide Arm customers with access to Intel's leading foundry capabilities.

What is CSS from Arm?

CSS stands for Compute Subsystem and refers to Arm providing full verified and validated subsystems incorporating CPUs, GPUs, interconnects etc. rather than just separate IP blocks.

How will AI change engineering design cycles?

AI will significantly enhance engineers' productivity by automating time-consuming tasks, reducing errors, and amplifying creativity to accelerate innovation.