‘Semiconductor Manufacturing Process’ Explained | 'All About Semiconductor' by Samsung Semiconductor

Samsung Semiconductor Newsroom
8 Oct 202207:44

Summary

TLDRThis video script offers an insightful look into the semiconductor industry, detailing the crucial steps in chip manufacturing. Starting with silicon extraction from sand, it explains the wafer production, followed by processes like oxidation, photolithography, etching, deposition, and ion implantation to create conductive circuits. The script also covers metal wiring, EDS testing, and packaging, concluding with the final product testing. It provides a comprehensive understanding of semiconductor chip production.

Takeaways

  • 🌟 Semiconductors are made from silicon, which is extracted from sand and then processed into wafers.
  • 🔍 The wafer manufacturing process involves melting sand to form a silicon ingot, which is then sliced into thin wafers.
  • 🛠️ Polishing machines are used to smooth the surface of the wafers to remove defects that could affect circuit precision.
  • 🛡️ Oxidation is a crucial step where an oxide film is created on the wafer surface to protect it and prevent current leakage.
  • 🎨 Photolithography is likened to developing a photo, where a circuit pattern is transferred onto the wafer using light and a photomask.
  • ✂️ Etching removes unnecessary materials to leave behind the designed circuit pattern, using either wet or dry etching techniques.
  • 💼 Deposition involves applying a thin film to the wafer to give it electrical characteristics, requiring precise technology.
  • 🚀 Ion implementation introduces impurities to make the silicon conductive, thus turning it into a semiconductor.
  • 🔌 Metal wiring creates a path for electricity to flow through the semiconductor according to the circuit pattern.
  • 🔍 EDS (Electrical Die Sorting) is a testing process to ensure flawless semiconductor chips and calculate yield.
  • 📦 The final packaging process involves cutting the wafer into individual chips, bonding them to a substrate, and molding them into their final form.

Q & A

  • What is the primary material used in semiconductor manufacturing?

    -The primary material used in semiconductor manufacturing is silicon, which is extracted from sand.

  • How is the silicon ingot transformed into a wafer?

    -The silicon ingot is sliced into thin, disc-shaped wafers using a process that involves melting sand into a high purity liquid and then solidifying it through crystallization.

  • What is the purpose of polishing the wafer surface?

    -The wafer surface is polished to smoothen its rough surface and remove defects that could negatively affect the precision of the circuits.

  • Why is the oxidation process necessary in semiconductor manufacturing?

    -The oxidation process is necessary to form a uniform oxide film on the wafer surface, which protects it during subsequent processes and blocks current leakage between circuits.

  • What is photolithography and how does it relate to semiconductor manufacturing?

    -Photolithography is a process where a circuit design is transferred onto a wafer by using light to expose a photosensitive material through a photomask, creating a pattern similar to developing a photo.

  • How does the etching process contribute to semiconductor manufacturing?

    -The etching process selectively removes unnecessary materials to leave behind the desired circuit pattern. It can be done using wet etching with chemical solutions or dry etching with gas or plasma.

  • What is the role of deposition in semiconductor manufacturing?

    -Deposition is a process where a thin film is coated onto a wafer at a molecular or atomic level to provide the semiconductor with specific electrical characteristics.

  • Why is ion implementation important in semiconductor manufacturing?

    -Ion implementation is crucial as it introduces impurities into the silicon to give it conductive properties, allowing it to conduct electricity and function as a semiconductor.

  • What is the metal wiring process and its significance?

    -The metal wiring process involves depositing a thin metal film to create paths for electricity to flow according to the circuit pattern, enabling the semiconductor chip to function.

  • What does EDS stand for in semiconductor manufacturing and what is its purpose?

    -EDS stands for Electrostatic Discharge, and it is a testing process to ensure flawless semiconductor chips by sorting out defective ones and calculating yield.

  • How is a semiconductor chip packaged for use in electronic devices?

    -After passing EDS, semiconductor chips are cut into individual units, connected to a substrate in the bonding step, and then molded into their final form to protect them from external elements.

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Related Tags
SemiconductorSilicon WaferManufacturingOxidationPhotolithographyEtchingDepositionIon ImplantationMetal WiringTestingPackaging