Intel's Crazy Plan for AI Chips IS WORKING! (Supercut)
Summary
TLDRIntel CEO Pat Gelsinger outlines the company's bold vision to become the world's leading chip manufacturer and foundry. He announces major advancements like the Intel 18A and 14A processes, extending Moore's Law into the angstrom era, as well as partnerships with Microsoft and Arm. Other Intel leaders then detail plans to revolutionize the foundry business through advanced 3D packaging to enable new 'systems of chips', immersion cooling, and other innovations to pave the way for ubiquitous AI while addressing sustainability.
Takeaways
- 😊 Intel is investing heavily in AI compute, energy and data centers to meet demand for AI services
- 😎 Intel believes AI will be one of the greatest tools invented, enabling abundant intelligence
- 😏 Intel encourages cautious optimism about AI to ensure responsible development
- 🤓 Intel is focused on delivering 5 leading edge nodes in 4 years to regain process leadership
- 👷♂️ Intel aims to become the #2 semiconductor foundry in the world
- 🌎 Intel wants to build the world's most resilient and sustainable foundry supply chain
- 🚀 Intel is venturing into the angstrom era with new transistor architectures
- 📈 Intel is expanding and enhancing its process nodes roadmap to ensure customer access
- 🔌 Intel offers advanced assembly, test and packaging technologies for AI systems
- ✨ Intel aims to optimize systems-on-chip and build interconnected systems-of-chips for AI
Q & A
What is the main purpose of Intel Foundry Services?
-The main purpose is to establish Intel as a leading foundry provider that can enable the development of advanced semiconductors and help build resilient, sustainable, and trusted supply chains.
Why does the industry need more 'resilient' supply chains?
-Because currently 80% of semiconductors are produced in a small, concentrated area in Asia. This centralization creates risks, so there is a need for more geographically distributed capacity to improve resilience.
What is 'angstrom era' referring to?
-The angstrom era refers to the next generation of process nodes that measure features in the atomic-scale range of angstroms (less than 1 nanometer), including Intel nodes 20A and 18A.
How will new transistor architectures benefit computing?
-The new transistor architectures like 'ribbonFET' will enable faster, more efficient computing at the atomic scale to power things like AI and advanced workloads.
Why is advanced packaging becoming so important?
-Because monolithic chips are hitting limitations in terms of yield, cost and thermal constraints. Advanced multi-chip packaging allows for greater flexibility and performance by combining different chips/chiplets.
What is the 'UCIe' interconnect Intel mentioned?
-UCIe is an open chiplet-to-chiplet interconnect standard Intel introduced, aiming to provide high-speed connectivity comparable to a PCI Express-like interface for multi-chip packages.
How will Intel Foundry Services help enable more efficient AI systems?
-By developing advanced packaging, cooling, memory and interconnect solutions tailored for AI workloads that allow customers to build lower cost and more power efficient systems of chips.
Why did Intel partner with Arm?
-Because Arm CPU and GPU IP is ubiquitous in the semiconductor industry. The partnership helps provide Arm customers with access to Intel's leading foundry capabilities.
What is CSS from Arm?
-CSS stands for Compute Subsystem and refers to Arm providing full verified and validated subsystems incorporating CPUs, GPUs, interconnects etc. rather than just separate IP blocks.
How will AI change engineering design cycles?
-AI will significantly enhance engineers' productivity by automating time-consuming tasks, reducing errors, and amplifying creativity to accelerate innovation.
Outlines
😀 Introducing the video and key questions
The first paragraph is an introduction to the video, welcoming Sam and asking him a few key questions about the $7 trillion investment in AI, why we should be optimistic about AI, and how to address concerns people may have about AI.
😊 Discussing Intel's progress with process technology
The second paragraph discusses Intel's progress in advancing its process technology, detailing the multiple new nodes and process improvements the company has made and will make down to the angstrom era with ribbons and transistors.
🏭 Presenting the strategy for becoming a leading foundry
The third paragraph presents Intel Foundry Services' strategy for becoming the number two foundry in the world, discussing the need for resilient and sustainable supply chains and Intel's unique packaging and interconnect capabilities.
💡 Explaining the concept of a systems foundry
The fourth paragraph explains the concept of a systems foundry, detailing how it involves breaking up monolithic devices into chiplets and tiles across advanced nodes and packaging them together to enable customers to optimize and scale AI systems.
🔋 Addressing efficiency and costs to make AI ubiquitous
The fifth paragraph discusses how making AI ubiquitous will require greatly improved efficiency and reduced costs for AI compute, detailing estimates for massive future power needs and Intel's 5 year roadmap to improve efficiency.
👥 Partnering with Arm to fuel innovation
The sixth paragraph discusses Intel's new partnership with Arm to fuel innovation through co-investments, joint programs, IP and shuttle scaling to support the growth of AI and advanced packaging.
Mindmap
Keywords
💡Moore's Law
💡AI
💡Foundry
💡Packaging
💡Nodes
💡EUV
💡Chiplets
💡Sustainability
💡Resilience
💡Standards
Highlights
Investing a lot of money in AI compute, energy data centers is going to be important to deliver the services people want
This is a worldwide investment to help many many different efforts many different people, and not just chips
AI could soon be one of the greatest tools humans have yet invented
People are right to be cautious about AI. I think this is going to be an extraordinarily powerful technology
Getting AI systems out there early so people can adapt and think and provide input
Announcing Intel 14a, venturing deeply into the angstrom era with 1.4 nanometer technology
AI era needs advanced wafers but it even needs more systems and packaging capabilities, an area Intel is the clear leader in
You can no longer do just monolithic devices, you have to break it up for thermal profiles, costs and flexibility
To train models with 100,000 CPUs now and potentially up to 10 million in future requires standards everywhere from chips inside to chips outside
Argonne National Lab used a 66,000 chip system to model fusion reactions and cancer curing drugs at the molecular level
Bringing AI everywhere requires figuring out how to do it cost effectively
Announcing partnership with ARM to bring design capability and education out to all their customers
Time waits for no one. Reducing design times through partnerships is hugely beneficial
The only limitation to what we can do with AI is your imagination
Change from AI will only accelerate as it impacts your work, business and life
Transcripts
hey Sam thanks so much for joining us of
course and uh Hey a couple of quick
questions you know the first one is 7
trillion what's this all about anyway
look uh as as I'm sure you all know you
shouldn't believe everything you read in
the Press really we do think the the
kernel of Truth is that we do think that
investing a lot of money in AI compute
energy data centers is going to be
important to deliver the the amount of
services people want and the tools that
we all are going to really I think get a
huge amount of value out of to help
create better Futures mhm so there's a
lot of investment to be made here I
think so but it's across a lot of stuff
it's not I mean it's a this is like a
worldwide investment to help many many
different efforts many different people
and not just chips of course but sort of
the whole infrastructure stack around it
okay second question you and I are both
Tech optimists a little bit so why
should we be Tech optimists about AI I
think this is going to be one of the
greatest tools humans have yet invented
if if you think about what we we can do
with more intelligence available to us U
more abundant intelligence cheaper
prices things that humans on their own
are not capable of uh we will all be
able to invent new things for each other
that astonish us that's how the future
gets better making things more
intelligent I like it when you say that
uh third question our founder Andy Grove
famously said the paranoid survive right
paranoid about yourself your success but
also paranoid about competition and
things that could go wrong and there are
those who are a little bit paranoid
about AI today what do you say to them I
think people are right to
be cautious about AI I think this is
going to be an extraordinarily powerful
technology I think it's going to reshape
significant parts of the way we live and
work and that our economy runs and part
of our strategy what we call iterative
deployment is that we want to put these
things out into the world early so that
people can adapt and think and provide
input and that uh we can be ready for
the man of change that will come over
time so I think that's great yeah
getting them out there early people test
them that's how things get better yeah
making them itely better well Sam you've
honored Us by joining Intel Foundry date
right the partnership that we have with
you is tremendous we're going to do
great science together great AI machines
together and uh just fundamentally make
the world a better place thank you so
much thank you for having
[Music]
me Moors law alive and well until the
periodic table is exhausted we are not
done with Mo's law we Bend physics we
create molecules we do amazing things
and Moore's Law is alive and well but we
have to do it a different way we have to
enable globally resilient sustainable
and trusted Supply chains and at the end
of our conference today I'm joined by
Sam Altman and he's going to challenge
the capacity needs of the industry and
the system of chips needs new
capabilities new tests and packaging
capabilities and that's what a systems
Foundry does and as we describe this
Vision to become the number two Foundry
of the world we realized there's only a
few companies that can do this that have
the capital capacity that have the R&D
the longevity to go do this and now as
we're in an economic downturn ah welcome
to semiconductors and then the AI
explosion and the cyclicality of the
industry and we've seen the Geo
instability and active Wars in Israel
and Ukraine and the tensions and Taiwan
on Straits this is anything but a
resilient supply chain today and for
that get to be a large meaningful the
second largest Foundry but become the
world's most sustainable Foundry the
world's most resilient Foundry because
that's exactly what the world requires
but stunningly you know in 1990 80% of
the semiconductors are built in us and
Europe today 80% in a small concentrated
area in Asia you know we've seen this
long steady decline right in terms of
our supply chains for the world nothing
should be reliant on a single port to a
single country a single place in the
world we need resilience a resilient
access to supply chains and capacity in
the right regions at the right time and
thus the choice the opportunity to drive
systemic change in where and how we
drive the most important aspect of our
future where the technology Supply
chains are what aspect of your life is
not becoming more
digital well everything is your
Healthcare your financial you're social
and with that we simply call it silicon
ofy silicon and the economy becoming
fused together in an inextricable way
and as stewards of Moore's Law we see
this Relentless pursuit of more
efficient more capable more scalable
Computing and for that we've been on
this journey we also announced that
we're we're going to get five nodes in
four years we're going to do something
unheard of in the industry to return
Intel to process technology leadership
and while we're not finished today we
see the end is soon in front of us on
that journey and Intel 7 shipping and
ramping and volume Intel 4 with our cor
ultr launch shipping and ramping and
volume Intel 3 is production certified
and we'll be with our server products
launching in the first half of the Year
going into volume production so with
this we've gone on Incredible Journey
but then it continues into what we call
the angstrom era and for this Intel 20a
and Intel 18a the adoption of ribbon fed
a new transistor structure of power via
power delivery technology the Embrace of
the first major new transistor re
architecting since 12 this is a Mona
Lisa no no this is a rembrand no no no I
think it's a Michelangelo right sculpted
in Silicon right for these truly are
works of art and I am thrilled for the
progress and with that the finishes 18a
we've already sent into Fab our first
18a products and this is a test tiip for
Clearwater Forest so I'm thrilled this
is what we call a family photo so kids
come to Papa here we go five nodes in
four
years and I do want to announce describe
and give a moment to our latest newest
18a customer
my decades long friend Sacha Nadella
speaking for Microsoft as the newest 18a
customer let's hear from Sacha now thank
you so much Pat it's great to join you
at your launch event it's clear that we
are in the midst of a very exciting
platform shift that'll fundamentally
transform productivity for every
individual organization and the entire
industry uh to achieve this Vision we
will need a reliable supply of the most
advanced high performance and
highquality semiconductors and all of us
at Microsoft are committed to supporting
Intel's efforts to build a strong supply
chain right here in the United States
that's why we're so excited to work with
Intel Foundry services and why we have
chosen a chip design that we plan to
produce on Intel's 18a process uh we
look forward to sharing more details in
the future and I can't wait to see all
that we will be delivering together for
our customers in the years ahead thank
you so very much thank you Sacha so can
I tell you more about what comes after
18a today we're announcing that we're
extending these nodes we're adding major
and minor uh nodes to it a combination
of older and Leading Edge nodes to
ensure our customers have access to the
process technology they need today we
are announcing Intel 14a for the first
time you think about this like four 1.4
nanometer technology but Intel
14a venturing deeply into the angstrom
era 14a first
processing
but we're also announcing that we're
extending our nodes as you see on here
adding P noes enhancements to those
existing adding performance capabilities
adding t- noes uh through silicon via
new feature enhancements with e noes on
the road map filling out that road map
of capability today we're announcing for
the first time Intel 16e enhancements to
our Intel 16 technology as well so we're
filling out that full set of nodes the
road map that we have to go beyond it
but as we've seen as we've gone through
this period of time this AI era
explosion Wafers are cool packaging has
gotten to be really cool so Intel
Foundry offers a broad set now of
advanced assembly and test uh
Technologies Intel 25 years ago drove
the standardization of organic packages
now we're driving the next generation of
glass based packages and with that the
ability to directly inter with Optics
and wave guides directly into the
package construct for the most advanced
system capabilities as well you know and
Intel Foundry has added a number of
additional AI customers to our portfolio
of packaging offerings as well AI era
needs Advanced Wafers but it even needs
more systems and packaging capabilities
an area that Intel is the clear leader
in and this now includes as customers
some of the largest AI leaders in the
world as I include my time on stage
today is a day 3 years in the
making and I couldn't be prouder of the
team at Intel that is ralling behind
this rebuilding of this iconic company
and you're going to hear from a number
of those leaders today bringing together
the world's first system Foundry
capabilities for the AI era and with
that it's my pleasure to introduce to
the stage a friend for decades now and
the the zealous leader of our Foundry
Services none other than Stu pan please
welcome Stu to the
St our people can sense and feel this
momentum you can hear it in their voices
you can see it in their actions they
know that you don't need to be in Taiwan
to build the world's most advanced
semiconductors theyve realized this five
NOS in four years this audacious goal
that Pat laid out you can see the check
marks across all the boxes here we're
ready to earn the right to be your
Foundry supplier nobody's going to give
us that we want to earn it so that's one
perspective I want to offer up a second
perspective and this comes from Chris
Miller the author of the book Chip War
this is a New York Times bestseller fin
Financial Times book of the Year took
Chris 10 years to write it now Chris in
a speech in October said this quote to
the employees said quotequote Intel is
the most important company of the last
50 years so I called Chris I said are
you okay if I say this publicly it's
yeah okay go ahead good publicity for
the book I came back to Intel 3 months
after pat did because I believe this
quote to be true and I believed it long
before Chris said it and what you're
going to hear in the next 40 minutes or
so is all the reasons why Chip War
season 2 is about to begin so let's
start from the
beginning Gordon's original paper was
called cramming more components on
integrated circuits it was published in
1965
every time I read it I'm stunned by how
pressing he was in the last section of
the paper Gordon remarks we come to a
Day of
Reckoning quote unquote it may prove to
be more economical to build large
systems out of smaller functions which
are separately packaged and
interconnected and this is why I believe
we're in the area of the systems Foundry
you can no longer do just monolithic
devices you have to break it up you have
to adust for thermal profiles you have
to address costs you have to have
flexibility and this is all driving a
new level of systems thinking Into The
Foundry business in this systems era you
not only have to have Open Standards
between devices you have to have
standards on the device think about the
fact of to do a training model day
requires 100,000 CPUs all running and
concert all in the same data set the
next round of training models will
require a million CPUs that's something
that requires standards everywhere from
chips inside to chips outside this is
what's necessary
for our customers succeed and this is
the fundamental reason why Intel is a
systems company turning into a Foundry
not the other way around so now that we
described system thinking let's look at
how the original Foundry model was
created now since CC way has been kind
enough to mention Us in his last few
earnings calls I thought i' return the
favor and talk about tsmc in my
presentation now this was a presentation
that Morris chain gave at MIT MIT last
October and in it he describes The
Foundry model he says it's research and
development it's waer fabrication it's
Advanced
packaging and he says in the red line
that's what tsmc does and said in the
blue line Intel everybody else does
everything else you might even call that
an IDM 1.0 kind of manufacturer now tsmc
has been incredibly successful with this
model discipline execution discipline
strategy consistent Innovation but to
quote Bob Dylan The Times They are
changing
let me tell you
why this there's an idea of Systems
Technology co-optimization where you
look at application workload Software
System architecture memory interconnect
all these different things what happens
today is people focus on their layer and
maybe the layer up on top of it in fact
this is really what a classic Foundry
does today but we're now in the realm of
the exponential Sam alman's going to
come out later on this afternoon and
talk about he doesn't have enough
capacity to do what he wants to do you
have to look at all of these
combinations you can get a couple of
things right but to do a system that
coordinates the activities of solving a
training model across 100,000 CPUs
requires you to get all the gear ratios
right if you're mismatched in memory if
you're mismatched in networking you wind
up throwing away valuable cycles and
valuable resources so we got to get 100x
more out of what we're doing so we
described the evolution now let's build
out the strategy and talk about what's
the revolution in all this we like to
think about this in three basic
layers first off we have to be a
world-class foundary right Rowan Chen
the COO of Qualcomm talks about the fact
that silicon speaks and silicon speaks
in four different ways performance power
area and cost without that you're not in
the business the next layer of the
pyramid is all about resilient
sustainable suppli this need to have
capability around the world to build
this and to build it in a sustainable
fashion the top layer of the pyramid is
this idea of systems of chips we're
putting system inside a chip and we're
working with our Foundry Partners to
create systems of chips so let's walk
you through what that means now I talked
earlier about this Day of Reckoning what
that means it's happening now we can no
longer do designs at a monolithic level
we are now at retical limited designs
design sizes that are 800 square millim
of silicon because we have to move
Beyond Ral limits and thermal
constraints and by the even cost
constraints because when you're building
these really big die sizes they're
really expensive isn't there a better
way to take advantage as Pat talked
about to take smaller tiles on the more
advanced notes get better yields out
them package them together have more
flexibility to do all that really
requires if you will a system amount of
chips so you can see in the animation
here how we build it out and this is
literally how we're going to build out
in the factory the idea of a substrate
the idea of Base dieses the idea of
logic tiles the idea of IO tiles on the
side why do this it gives our customers
the ability to optimally trade for what
they need for their design the things
that you do for a training engine will
be different than what you do for an
inference engine and only by having all
these levers to go pull can you get this
done we learned a lot through a device
called ponovo or as The Branding people
call Intel data center GPU Max series
it's ANC it's 100 billion transistor s
so it's dozens of chiplet tiles 47 of
them it's multiple suppliers by the way
we coexist with tsmc in the same package
right we develop testing techniques to
go off and do that we do this idea of
singulated die test what does that mean
it means every single die that goes into
that package is a known good die why is
that important because you want every
one of them to be good the assembly test
shield on this device is 95% plus it is
the Super Bowl of integrated design now
what do you do with it well if you're
argon National Labs and our partners at
HP you build a really big supercomputer
and they built a computer that was
66,000 Pacos 20,000 Sapphire Rapids and
it looks like
this okay what do you do with something
like that well you solve some really
hard science problems if you want to
model the airf flow across the wing you
can do that on a workstation if you want
to model the air flow across a plane you
do it on this if you want to model
Fusion reactions which are pretty tricky
things to model you do it on a device
like this if you want to model if you
want to model cancer curing drugs at the
molecular level you do it like
this it's 600 tons of compute it's four
tennis courts it is the weight of an
Airbus it has 300 miles of optical cable
it takes 34,000 gallons a minute to Cool
by the way your faucet at home it's a
gallon a minute 34,000 gallons a minute
so when we talk about how to design the
stuff we have to find ways to make this
more power efficient to make this more
cost effective this today is the second
fastest super computer in the world by
the way at 100,000 CPUs roughly to
handle the demands of AI we're going to
go far beyond that and that's why this
idea of scalability is so
important now let's go through the top
of the pyramid this idea of systems of
Chip systems of Chip require as Pat
mentioned great packaging technology
we've created standard called UCI which
allows chipto chip connectivity think of
it as the PCI Express of what we did
back in the mid 90s this idea that you
can add mix and match by the way you can
mix and match different Foundry
suppliers we like that because we're
sort of an underdog in all this some of
our competitors not so much
but our customers want this kind of
flexibility so as you can see from the
rendering what we're doing is
taking systems on a
chip and Building Systems of chips why
do you need systems of chips because
it's the same problem I mentioned
earlier you need to train models with
100,000 CPUs now and a million
potentially down the road and maybe up
to 10 million when you're moving a
coordinating data across all of these
devices you need to have standards and
connectivity and that's what we provide
and really when you think about it what
is what's it going to take to bring AI
everywhere how do you make it cost
effective how do you make it capital
efficient yes yeah I know Sam's asking
for trillions but we want to make sure
he's spending all that money in the most
costeffective manner possible so let's
break that
out you have data center chips doubling
year on-ear but the efficiency needs are
the things that are really eye-catching
New York Times ran an article that AI
could soon need as much electricity as
an entire countries so I'm sure you're
curious like which countries Sweden the
Netherlands Argentina if you were to run
all of the AI servers that market
estimates have on djx2 dx100 those kind
of devices you would take 85 to 134
terawatt hours terawatt hours by the way
the great state of California its entire
power generation capability to day is 30
tratt hours for the entire state so
bringing AI everywhere is going to
require us in our Foundry Partners to
figure out how to do this cost
effectively this is what this road map
is going to take and this I think is
what makes us different than other
Foundry approaches you have to start off
across first off with table sticks as I
mentioned you have to start off with a
great process add to that packaging
which is we believe a unique differ for
us why we build a lot of server parts
and we're taking everything that we
learn from our server business and
offering up to our Foundry Partners
these are table stakes and this is what
it takes to be a Foundry player we have
this planned out literally across all
these dimensions for the next 5 years
let's talk about cooling I mentioned
that that argon needs 34,000 gallons a
minute to cool it off the next wave of
devices are going to have to be immersed
and cooled and today Intel Zeon product
line is the only product that offers an
immersion cooling warranty immersion
cooling allows us to deliver power much
more effectively in a data center we're
going to take what we've learned there
and we're going to offer that up to our
Foundry customers so that when we start
looking at 2,000 watt devices 5 years
from now we're going to have a way to
cool those memory how do perhaps do we
put memory on the device itself so it's
more computationally cost effective and
over the next five years you're going to
hear us talk a lot about new
technologies and new ways to increase
memory bandwidth why decreasing the need
for energy consumption a five-year kind
of
look
interconnects interconnects between
chips the idea of having high-speed
series highspeed interconnect all the
things that you expect from a Foundry
provider is what we're going to give you
and we're going to not plan out for just
what's out there today keep in mind as a
standards company we do this across all
different standards and it's our job to
make those standards available to all of
you and last you know networking think
about a net card that's capable of
handling demands of AI modeling what you
do with ethernet today isn't good enough
so working closely with a number of
ethernet standards Partners to figure
out ways how do we make ethernet more
capable
to develop the idea of systems of chips
and ethernet provides that lowcost high
bandwidth potential to go off and do
that add to that fonics add to that
Technologies beyond that here again it's
another 5-year road map this morning
we're announcing a new partnership with
arm merging business initiative how do
we take advantage of all the programs
that arm has to offer to bring design
capability design education out to all
of their customers we're doing this with
arm we will make co-investments we'll do
joint programs we'll provide shuttles at
scale arm will provide IP at scale and
this is how we're going to fuel this
next wave of innovation and it's truly
exciting so I'd like to now is invite R
to come up on stage with me hello sir so
good to have you here so Renee first off
in what kind of universe would you have
ever thought that you'd see arm and
Intel standing together but you we
rapidly came to the realization that 80%
of the way for tsmc runs has an armed
device in them there is no way you can
be in The Foundry Business Without A
partnership with arm and I think you'd
like to probably tell us about a few of
them starting with perhaps the
announcements you made this morning yeah
well thank you for having me as you said
this is a bit of strange bedfellows I
was trying to think of a parallel that I
might give relative the story and only
thing I could kind of think of is when
Walt Mossberg asked Steve Jobs what it
was like to see iTunes run on Windows
and I think he said it was like an ice
waterer in hell but I won't go that far
I won't go that far the announcements
that we made earlier today was around
our neoverse product line which is the
product line that we use for the data
center which has just been exploding it
was in a very very high growth
trajectory prior to the AI wave and now
it's become even stronger the Nee V3
that we announced today which is 50%
faster than the neoverse N2 and then our
N3 which is 20% faster but also much
more efficient and when you think about
these AI data centers which are pulling
hundreds of megawatts and and more
efficiency matters so yeah today was a
big day for arm we're working on on on
Cutting Edge technology when you talk
about 18a and and system foundering the
packaging this is uh the tip of the
spear in terms of innovation and you
guys have been terrific uh it has been
an absolute joy to work with your groups
the level of engineering engagement the
depth of the technical discussions uh
the information that we get uh we would
not be able to announce the partnership
that we've forged without it we talked a
little bit about Faraday let's talk a
little bit about what the world faray
plays in neoverse and CSS and why what
maybe to find for the a what is CSS and
why is it so important for everybody
here in the audience yeah so we
announced uh a new strategy some months
ago around what we call compute
subsystems and the way to think about
this is essentially rather than arm
delivering blocks of Ip uh a mesh
Network a memory controller the CPUs
themselves we deliver a full subsystem
fully verified completed that is if you
want 64 cores 96 cores 128 cores for a
CPU we deliver everything in terms of
that system validated verified and it
will work now one of the big benefits of
this is simply the fact that time waits
for no one the classic classic quote the
amount of time it takes to design these
s so's is really really hard and it's
really really long if we're delivering
final IP to a customer they still need
to put all those pieces together if we
can put all of that together for them
prior at the same date they would have
got the block of Ip that's a huge huge
benefit and then when you add on to it
the processing cycle times that are
getting longer and longer I know you
guys are doing your best but you know
more euv steps means more complex time
through the Fab and that just means that
ultimately the processing times are long
you have complex packaging you know that
adds a lot of time so anything you can
do on the front end to benefit the
design time is is really beneficial so
we announced this program called uh arm
total design of Which Intel is a partner
and in that model customers can come to
their partners and work with those folks
to get their design out and that's what
Faraday is so Faraday is basically doing
that they'll be able to put their IP
together with our blocks and something
that just end quote works and everyone
wins the product's out faster it's
compliant and it's going to work
outstanding or Rene thank you for coming
and joining us on today today pleasure
totally appreciate the partnership and
everything we're doing together
everything we're going to do together
thanks again thanks all
[Music]
so to finish out my talk I'd like to go
back to where I started this is an ad
rolled at the Super Bowl 1997 the year
the Green Bay Packers beat the Patriots
the halftime show was The Blues Brothers
and James Brown and it was eight years
after Taylor Swift was
born I had to do it you can't associate
superos without Taylor Swift and this
commercial was
iconic but you know things have changed
a lot over the last several years and
that change is only only going to
accelerate as AI impacts your work your
business your life how AI impacted the
design cycle AI improves the capability
for your engineers to do so much more
with so much less effort so we decided
to do with this commercial was take a
generative AI view of it so this
commercial no buy people were harmed we
did 100% AI rendered it was done by very
creative director Dave Clark out of Los
Angeles and he's a big advocate of using
AI tools not to take away creativity but
to amplify creativity so as you leave
our session today remember this that the
only imitation to what we can do with AI
is your imagination thank
[Applause]
you
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