‘Semiconductor Manufacturing Process’ Explained | 'All About Semiconductor' by Samsung Semiconductor
Summary
TLDRThis video script offers an insightful look into the semiconductor industry, detailing the crucial steps in chip manufacturing. Starting with silicon extraction from sand, it explains the wafer production, followed by processes like oxidation, photolithography, etching, deposition, and ion implantation to create conductive circuits. The script also covers metal wiring, EDS testing, and packaging, concluding with the final product testing. It provides a comprehensive understanding of semiconductor chip production.
Takeaways
- 🌟 Semiconductors are made from silicon, which is extracted from sand and then processed into wafers.
- 🔍 The wafer manufacturing process involves melting sand to form a silicon ingot, which is then sliced into thin wafers.
- 🛠️ Polishing machines are used to smooth the surface of the wafers to remove defects that could affect circuit precision.
- 🛡️ Oxidation is a crucial step where an oxide film is created on the wafer surface to protect it and prevent current leakage.
- 🎨 Photolithography is likened to developing a photo, where a circuit pattern is transferred onto the wafer using light and a photomask.
- ✂️ Etching removes unnecessary materials to leave behind the designed circuit pattern, using either wet or dry etching techniques.
- 💼 Deposition involves applying a thin film to the wafer to give it electrical characteristics, requiring precise technology.
- 🚀 Ion implementation introduces impurities to make the silicon conductive, thus turning it into a semiconductor.
- 🔌 Metal wiring creates a path for electricity to flow through the semiconductor according to the circuit pattern.
- 🔍 EDS (Electrical Die Sorting) is a testing process to ensure flawless semiconductor chips and calculate yield.
- 📦 The final packaging process involves cutting the wafer into individual chips, bonding them to a substrate, and molding them into their final form.
Q & A
What is the primary material used in semiconductor manufacturing?
-The primary material used in semiconductor manufacturing is silicon, which is extracted from sand.
How is the silicon ingot transformed into a wafer?
-The silicon ingot is sliced into thin, disc-shaped wafers using a process that involves melting sand into a high purity liquid and then solidifying it through crystallization.
What is the purpose of polishing the wafer surface?
-The wafer surface is polished to smoothen its rough surface and remove defects that could negatively affect the precision of the circuits.
Why is the oxidation process necessary in semiconductor manufacturing?
-The oxidation process is necessary to form a uniform oxide film on the wafer surface, which protects it during subsequent processes and blocks current leakage between circuits.
What is photolithography and how does it relate to semiconductor manufacturing?
-Photolithography is a process where a circuit design is transferred onto a wafer by using light to expose a photosensitive material through a photomask, creating a pattern similar to developing a photo.
How does the etching process contribute to semiconductor manufacturing?
-The etching process selectively removes unnecessary materials to leave behind the desired circuit pattern. It can be done using wet etching with chemical solutions or dry etching with gas or plasma.
What is the role of deposition in semiconductor manufacturing?
-Deposition is a process where a thin film is coated onto a wafer at a molecular or atomic level to provide the semiconductor with specific electrical characteristics.
Why is ion implementation important in semiconductor manufacturing?
-Ion implementation is crucial as it introduces impurities into the silicon to give it conductive properties, allowing it to conduct electricity and function as a semiconductor.
What is the metal wiring process and its significance?
-The metal wiring process involves depositing a thin metal film to create paths for electricity to flow according to the circuit pattern, enabling the semiconductor chip to function.
What does EDS stand for in semiconductor manufacturing and what is its purpose?
-EDS stands for Electrostatic Discharge, and it is a testing process to ensure flawless semiconductor chips by sorting out defective ones and calculating yield.
How is a semiconductor chip packaged for use in electronic devices?
-After passing EDS, semiconductor chips are cut into individual units, connected to a substrate in the bonding step, and then molded into their final form to protect them from external elements.
Outlines
🔬 Semiconductor Manufacturing Process
This paragraph delves into the intricate world of semiconductor manufacturing, starting with the foundational material, silicon. The script explains how silicon is extracted from sand and transformed into a wafer through processes like melting, crystallization, and slicing. The wafer serves as the base for constructing semiconductor chips, akin to the foundation of a building. The narrative then explores the essential steps in semiconductor production, including oxidation to form a protective oxide film, photolithography to transfer circuit designs onto the wafer, etching to carve out the unnecessary materials, and deposition to apply thin films for insulation and protection. Additionally, ion implementation is mentioned as a method to alter the conductivity of the silicon wafer. The paragraph concludes by emphasizing the complexity and precision required in these processes to create the high-rise structure of a semiconductor chip.
🔌 Metal Wiring and Packaging of Semiconductors
The second paragraph focuses on the latter stages of semiconductor chip production, starting with the metal wiring process. This step is crucial for creating conductive paths that allow electrical signals to flow according to the designed circuit pattern. The use of materials like aluminum, titanium, or tungsten for depositing thin metal films is highlighted. The script then moves on to discuss EDS, a testing phase designed to identify and eliminate defective chips, impacting the yield rate. The final process covered is packaging, which involves cutting the wafer into individual chips, bonding them to a substrate, and molding them into their final form for protection and signal exchange. The importance of testing before a chip is considered a finished product is underscored, completing the overview of the semiconductor manufacturing journey. The paragraph ends with an invitation for viewers to stay engaged for more educational content on semiconductors.
Mindmap
Keywords
💡Semiconductor
💡Wafer
💡Oxidation
💡Photolithography
💡Etching
💡Deposition
💡Ion Implantation
💡Metal Wiring
💡EDS (Electrical Die Sorting)
💡Packaging
Highlights
The semiconductor industry is interconnected and constantly evolving.
Semiconductor manufacturing processes are essential for the industry's functioning.
Silicon is the main material used to make semiconductors, extracted from sand.
Wafer manufacturing is the foundational process for creating semiconductor chips.
The process of turning sand into a wafer involves melting and crystallization.
Wafers are polished to remove surface defects which could affect circuit precision.
The term 'wafer' originates from the word 'biscuit', indicating its thin disc shape.
Larger wafer diameters allow for more chips to be produced per wafer.
Oxidation is necessary to make wafers semi-conductive by forming a protective oxide film.
Photolithography is the process of transferring a circuit design onto a wafer.
Photomasks function as the 'film' in the photolithography process for semiconductors.
Photoresist material is applied to the wafer to allow for pattern transfer under light exposure.
Etching removes unnecessary materials to leave only the desired circuit pattern.
Deposition is the process of applying a thin film to give the semiconductor its electrical characteristics.
Ion implementation introduces impurities to make the semiconductor conductive.
Metal wiring creates a path for electrical signals to flow through the semiconductor.
EDS is the testing process to ensure flawless semiconductor chips and calculate yield.
Packaging is the final process that protects the semiconductor and allows for electrical signal exchange.
The semiconductor chip is completed after final testing to become a finished product.
The manufacturing process is divided into pre-process for wafer processing and post-process for testing and packaging.
Transcripts
in this video we help you understand the
semiconductor industry which is
interconnected and constantly evolving
in the enormous semiconductor ecosystem
today let's learn about the essential
semiconductor manufacturing processes
in the first episode we talked about
silicon the main material which is used
to make semiconductors in order for
silicon to turn into a semiconductor
chip it needs to go through the
essential processes of wafer
manufacturing oxidation photolithography
etching deposition and ion
implementation metal wiring EDS and
packaging let's take a closer look at
these processes
[Music]
semiconductors are stacked high and
solid to form a complex structure
similar to a high-rise building
constructing a building starts with the
foundation a wafer is the foundation for
the semiconductor most Wafers are made
of silicon extracted from Sand how can
these tiny grains of sand become a wafer
first sand is heated until it melts into
a high Purity liquid and then gets
solidified by crystallization the
resultant silicon Rod is called an Ingot
these ingots are sliced into a disc
thinly sliced Wafers the surface of
slice Wafers is rough and contains
defects so polishing machines are used
to polish the surface of the wafer the
reason is that defects on the surface
could negatively affect the Precision of
circuits if you look at a photo of
Wafers you can see a grid pattern on the
surface yes the word wafer comes from
biscuit Wafers a wafer made this way is
the main material for semiconductors
because the larger the diameter is the
greater the number of chips that can be
produced per wafer is so the diameter of
Wafers is becoming larger
because the resultant thin disc shaped
wafer is not conductive yet a process to
make Wafers semi-conductive is required
first Wafers go through the oxidation
process oxygen or water vapor is sprayed
on the wafer surface to form a uniform
oxide film this oxide film protects the
wafer's surface during the following
processes and also blocks current
leakage between circuits the film acts
as a strong protective shield
now the foundation is ready
the building up process begins just as
you draw blueprints to build a building
you draw a circuit design onto a wafer
which is called the photolithography
process it is called photo for short
because it is similar to developing a
photo taken on a film camera with
semiconductors a photomask functions as
the film
a photo mask is a glass substrate with a
computer design circuit pattern
in order to draw the circuit on the
wafer the photoresist a material that
responds to light is applied thinly and
evenly on the oxide film previously
placed on the wafer now when light
transfers the pattern photo mask the
circuit is drawn on the wafer surface
just like developing a photo a circuit
pattern is imprinted on the wafer by
spraying developer and removing unlit
areas from the areas that are exposed to
light
after an inspection of the wafer to
check whether the pattern is drawn well
it moves on to the next step
now unnecessary materials are carved out
so that only the design pattern remains
using a liquid or gas etching
unnecessary materials are selectively
removed to draw the desired design when
chemical Solutions are used for etching
it is called wet etching and when gas or
plasma is used it is called dry etching
we will talk about these details in the
future
let's imagine constructing a building on
a semiconductor chip smaller than a
fingernail and thinner than a sheet of
paper
the photo lithography process and the
etching process are repeated several
times on the wafer layer by layer
here an insulating film that separates
and protects the Stacked circuits is
required it is called a thin film
coating the thinned film at a desired
molecular or Atomic level onto a wafer
is called deposition since the coating
is so thin precise and sophisticated
technology is required to uniformly
apply the thin film on a wafer to give
the semiconductor electrical
characteristics ion implementation is
also required
a semiconductor made of silicon does not
conduct electricity but adding
impurities it conducts current and has
conductive properties
in summary through the wafer
manufacturing oxidation photolithography
etching deposition and ion
implementation processes the wafer
becomes conductive and numerous circuits
are drawn on it
now in order for this circuit to work an
electrical signal must be applied it is
necessary to create a path for
electricity to pass through according to
the Circuit pattern this process is
called the metal wiring process it is a
process that allows electricity to Flow
by depositing a thin metal film using
materials such as aluminum Titanium or
tungsten so that electricity can pass
through the semiconductor well the chip
manufacturing processes are now coming
toward completion
the next step is EDS this is the process
of testing to ensure Flawless
semiconductor chips in other words it is
a testing step to sort out defective
chips yield is a percentage of prime
chips relative to the maximum chip count
on a single wafer the semiconductor chip
selected through the Eds process are
made in a form suitable for devices
this is the last process the packaging
process
the wafer completed through the previous
steps are cut into individual
semiconductor chips that can be loaded
on an electronic device
an individual chip must have a path to
exchange electrical signals with the
outside and have a form to protect it
from various external elements the wafer
is cut into individual chips and the
diced or sawed chips are placed on the
PCB board in the bonding step the
contact point of the semiconductor chip
placed on a substrate is connected with
the contact point of the substrate then
molding finishes the chip package to its
desired shape after sealing the
semiconductor and labeling the product
name the semiconductor chip we commonly
see is completed of course only after
going through the final test will it
become a finished product
foreign
we learned about the essential processes
that produce semiconductor chips these
complex processes can be separated into
the pre-process up to the wafer
processing stage and the post process
which contains the testing and packaging
processes
we hope you now have a better
understanding of how a semiconductor
chip is manufactured stay tuned for more
interesting semiconductor episodes if
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