‘Semiconductor Manufacturing Process’ Explained | 'All About Semiconductor' by Samsung Semiconductor

Summary

This video script offers an insightful look into the semiconductor industry, detailing the crucial steps in chip manufacturing. Starting with silicon extraction from sand, it explains the wafer production, followed by processes like oxidation, photolithography, etching, deposition, and ion implantation to create conductive circuits. The script also covers metal wiring, EDS testing, and packaging, concluding with the final product testing. It provides a comprehensive understanding of semiconductor chip production.

Takeaways

• 🌟 Semiconductors are made from silicon, which is extracted from sand and then processed into wafers.
• 🔍 The wafer manufacturing process involves melting sand to form a silicon ingot, which is then sliced into thin wafers.
• 🛠️ Polishing machines are used to smooth the surface of the wafers to remove defects that could affect circuit precision.
• 🛡️ Oxidation is a crucial step where an oxide film is created on the wafer surface to protect it and prevent current leakage.
• 🎨 Photolithography is likened to developing a photo, where a circuit pattern is transferred onto the wafer using light and a photomask.
• ✂️ Etching removes unnecessary materials to leave behind the designed circuit pattern, using either wet or dry etching techniques.
• 💼 Deposition involves applying a thin film to the wafer to give it electrical characteristics, requiring precise technology.
• 🚀 Ion implementation introduces impurities to make the silicon conductive, thus turning it into a semiconductor.
• 🔌 Metal wiring creates a path for electricity to flow through the semiconductor according to the circuit pattern.
• 🔍 EDS (Electrical Die Sorting) is a testing process to ensure flawless semiconductor chips and calculate yield.
• 📦 The final packaging process involves cutting the wafer into individual chips, bonding them to a substrate, and molding them into their final form.

Q & A

What is the primary material used in semiconductor manufacturing?

The primary material used in semiconductor manufacturing is silicon, which is extracted from sand.

How is the silicon ingot transformed into a wafer?

The silicon ingot is sliced into thin, disc-shaped wafers using a process that involves melting sand into a high purity liquid and then solidifying it through crystallization.

What is the purpose of polishing the wafer surface?

The wafer surface is polished to smoothen its rough surface and remove defects that could negatively affect the precision of the circuits.

Why is the oxidation process necessary in semiconductor manufacturing?

The oxidation process is necessary to form a uniform oxide film on the wafer surface, which protects it during subsequent processes and blocks current leakage between circuits.

What is photolithography and how does it relate to semiconductor manufacturing?

Photolithography is a process where a circuit design is transferred onto a wafer by using light to expose a photosensitive material through a photomask, creating a pattern similar to developing a photo.

How does the etching process contribute to semiconductor manufacturing?

The etching process selectively removes unnecessary materials to leave behind the desired circuit pattern. It can be done using wet etching with chemical solutions or dry etching with gas or plasma.

What is the role of deposition in semiconductor manufacturing?

Deposition is a process where a thin film is coated onto a wafer at a molecular or atomic level to provide the semiconductor with specific electrical characteristics.

Why is ion implementation important in semiconductor manufacturing?

Ion implementation is crucial as it introduces impurities into the silicon to give it conductive properties, allowing it to conduct electricity and function as a semiconductor.

What is the metal wiring process and its significance?

The metal wiring process involves depositing a thin metal film to create paths for electricity to flow according to the circuit pattern, enabling the semiconductor chip to function.

What does EDS stand for in semiconductor manufacturing and what is its purpose?

EDS stands for Electrostatic Discharge, and it is a testing process to ensure flawless semiconductor chips by sorting out defective ones and calculating yield.

How is a semiconductor chip packaged for use in electronic devices?

After passing EDS, semiconductor chips are cut into individual units, connected to a substrate in the bonding step, and then molded into their final form to protect them from external elements.

Outlines

00:00

🔬 Semiconductor Manufacturing Process

This paragraph delves into the intricate world of semiconductor manufacturing, starting with the foundational material, silicon. The script explains how silicon is extracted from sand and transformed into a wafer through processes like melting, crystallization, and slicing. The wafer serves as the base for constructing semiconductor chips, akin to the foundation of a building. The narrative then explores the essential steps in semiconductor production, including oxidation to form a protective oxide film, photolithography to transfer circuit designs onto the wafer, etching to carve out the unnecessary materials, and deposition to apply thin films for insulation and protection. Additionally, ion implementation is mentioned as a method to alter the conductivity of the silicon wafer. The paragraph concludes by emphasizing the complexity and precision required in these processes to create the high-rise structure of a semiconductor chip.

05:00

🔌 Metal Wiring and Packaging of Semiconductors

The second paragraph focuses on the latter stages of semiconductor chip production, starting with the metal wiring process. This step is crucial for creating conductive paths that allow electrical signals to flow according to the designed circuit pattern. The use of materials like aluminum, titanium, or tungsten for depositing thin metal films is highlighted. The script then moves on to discuss EDS, a testing phase designed to identify and eliminate defective chips, impacting the yield rate. The final process covered is packaging, which involves cutting the wafer into individual chips, bonding them to a substrate, and molding them into their final form for protection and signal exchange. The importance of testing before a chip is considered a finished product is underscored, completing the overview of the semiconductor manufacturing journey. The paragraph ends with an invitation for viewers to stay engaged for more educational content on semiconductors.

Keywords

💡Semiconductor

A semiconductor is a material that lies between a conductor and an insulator in terms of its electrical conductivity. It can control the flow of electrical current under certain conditions. In the context of the video, semiconductors are the core of modern electronics, used to create integrated circuits that power devices from smartphones to computers. The video discusses how semiconductors are manufactured, highlighting their importance in the technology industry.

💡Wafer

A wafer is a thin slice of semiconductor material, typically silicon, on which microelectronic circuits are built. Wafers serve as the foundational substrate for semiconductor devices. The video explains the process of creating wafers from silicon ingots, which involves slicing the ingots into thin discs and polishing their surfaces to prepare them for further manufacturing steps.

💡Oxidation

Oxidation in semiconductor manufacturing refers to the process of creating a protective oxide layer on the wafer's surface. This is achieved by exposing the wafer to oxygen or water vapor, resulting in a uniform oxide film. The oxide layer is crucial as it protects the wafer during subsequent processes and prevents current leakage between circuits. The video mentions this step as an essential part of preparing the wafer for further processing.

💡Photolithography

Photolithography is a technique used to transfer a pattern onto the wafer surface. It involves applying a photosensitive material called photoresist, which is then exposed to light through a photomask that carries the desired circuit pattern. The exposed areas of the photoresist are developed away, leaving the pattern on the wafer. This process is central to creating the detailed circuitry on semiconductor chips, as described in the video.

💡Etching

Etching is a process used to selectively remove parts of the wafer's surface to create the desired circuit patterns. It can be done using either chemical solutions (wet etching) or gas/plasma (dry etching). The video script mentions etching as a critical step following photolithography, where unnecessary materials are carved out to leave only the designed pattern.

💡Deposition

Deposition in semiconductor manufacturing involves applying a thin film of material onto the wafer at a molecular or atomic level. This process is essential for creating insulating films that separate and protect the stacked circuits within a chip. The video script describes deposition as a sophisticated technology that requires precision to uniformly coat the wafer.

💡Ion Implantation

Ion implantation is a process where impurities are added to the semiconductor material to alter its electrical properties, making it conductive. This process is crucial for creating the desired semi-conductive properties in the silicon wafer. The video explains that silicon itself does not conduct electricity, but with ion implantation, it gains the ability to conduct current.

💡Metal Wiring

Metal wiring is the process of creating conductive paths on the semiconductor chip to allow the flow of electrical signals according to the circuit pattern. This is achieved by depositing a thin metal film, typically using materials like aluminum, titanium, or tungsten. The video emphasizes metal wiring as a necessary step to make the circuit functional by providing a path for electricity to flow.

💡EDS (Electrical Die Sorting)

EDS, or Electrical Die Sorting, is a testing process used to ensure that semiconductor chips are flawless. It involves testing the chips to sort out any defective ones and calculate the yield, which is the percentage of prime chips relative to the maximum chip count on a single wafer. The video script highlights EDS as a critical step in the semiconductor manufacturing process to ensure quality control.

💡Packaging

Packaging in semiconductor manufacturing refers to the final process of preparing the wafer for use in electronic devices. This involves cutting the wafer into individual chips, bonding them to a substrate, and encapsulating them in a protective material. The video describes packaging as essential for protecting the chip from external elements and enabling it to exchange electrical signals with other components.

Highlights

The semiconductor industry is interconnected and constantly evolving.

Semiconductor manufacturing processes are essential for the industry's functioning.

Silicon is the main material used to make semiconductors, extracted from sand.

Wafer manufacturing is the foundational process for creating semiconductor chips.

The process of turning sand into a wafer involves melting and crystallization.

Wafers are polished to remove surface defects which could affect circuit precision.

The term 'wafer' originates from the word 'biscuit', indicating its thin disc shape.

Larger wafer diameters allow for more chips to be produced per wafer.

Oxidation is necessary to make wafers semi-conductive by forming a protective oxide film.

Photolithography is the process of transferring a circuit design onto a wafer.

Photomasks function as the 'film' in the photolithography process for semiconductors.

Photoresist material is applied to the wafer to allow for pattern transfer under light exposure.

Etching removes unnecessary materials to leave only the desired circuit pattern.

Deposition is the process of applying a thin film to give the semiconductor its electrical characteristics.

Ion implementation introduces impurities to make the semiconductor conductive.

Metal wiring creates a path for electrical signals to flow through the semiconductor.

EDS is the testing process to ensure flawless semiconductor chips and calculate yield.

Packaging is the final process that protects the semiconductor and allows for electrical signal exchange.

The semiconductor chip is completed after final testing to become a finished product.

The manufacturing process is divided into pre-process for wafer processing and post-process for testing and packaging.

Transcripts

in this video we help you understand the

semiconductor industry which is

interconnected and constantly evolving

in the enormous semiconductor ecosystem

today let's learn about the essential

semiconductor manufacturing processes

in the first episode we talked about

silicon the main material which is used

to make semiconductors in order for

silicon to turn into a semiconductor

chip it needs to go through the

essential processes of wafer

manufacturing oxidation photolithography

etching deposition and ion

implementation metal wiring EDS and

packaging let's take a closer look at

these processes

[Music]

semiconductors are stacked high and

solid to form a complex structure

similar to a high-rise building

constructing a building starts with the

foundation a wafer is the foundation for

the semiconductor most Wafers are made

of silicon extracted from Sand how can

these tiny grains of sand become a wafer

first sand is heated until it melts into

a high Purity liquid and then gets

solidified by crystallization the

resultant silicon Rod is called an Ingot

these ingots are sliced into a disc

thinly sliced Wafers the surface of

slice Wafers is rough and contains

defects so polishing machines are used

to polish the surface of the wafer the

reason is that defects on the surface

could negatively affect the Precision of

circuits if you look at a photo of

Wafers you can see a grid pattern on the

surface yes the word wafer comes from

biscuit Wafers a wafer made this way is

the main material for semiconductors

because the larger the diameter is the

greater the number of chips that can be

produced per wafer is so the diameter of

Wafers is becoming larger

because the resultant thin disc shaped

wafer is not conductive yet a process to

make Wafers semi-conductive is required

first Wafers go through the oxidation

process oxygen or water vapor is sprayed

on the wafer surface to form a uniform

oxide film this oxide film protects the

wafer's surface during the following

processes and also blocks current

leakage between circuits the film acts

as a strong protective shield

now the foundation is ready

the building up process begins just as

you draw blueprints to build a building

you draw a circuit design onto a wafer

which is called the photolithography

process it is called photo for short

because it is similar to developing a

photo taken on a film camera with

semiconductors a photomask functions as

the film

a photo mask is a glass substrate with a

computer design circuit pattern

in order to draw the circuit on the

wafer the photoresist a material that

responds to light is applied thinly and

evenly on the oxide film previously

placed on the wafer now when light

transfers the pattern photo mask the

circuit is drawn on the wafer surface

just like developing a photo a circuit

pattern is imprinted on the wafer by

spraying developer and removing unlit

areas from the areas that are exposed to

light

after an inspection of the wafer to

check whether the pattern is drawn well

it moves on to the next step

now unnecessary materials are carved out

so that only the design pattern remains

using a liquid or gas etching

unnecessary materials are selectively

removed to draw the desired design when

chemical Solutions are used for etching

it is called wet etching and when gas or

plasma is used it is called dry etching

we will talk about these details in the

future

let's imagine constructing a building on

a semiconductor chip smaller than a

fingernail and thinner than a sheet of

paper

the photo lithography process and the

etching process are repeated several

times on the wafer layer by layer

here an insulating film that separates

and protects the Stacked circuits is

required it is called a thin film

coating the thinned film at a desired

molecular or Atomic level onto a wafer

is called deposition since the coating

is so thin precise and sophisticated

technology is required to uniformly

apply the thin film on a wafer to give

the semiconductor electrical

characteristics ion implementation is

also required

a semiconductor made of silicon does not

conduct electricity but adding

impurities it conducts current and has

conductive properties

in summary through the wafer

manufacturing oxidation photolithography

etching deposition and ion

implementation processes the wafer

becomes conductive and numerous circuits

are drawn on it

now in order for this circuit to work an

electrical signal must be applied it is

necessary to create a path for

electricity to pass through according to

the Circuit pattern this process is

called the metal wiring process it is a

process that allows electricity to Flow

by depositing a thin metal film using

materials such as aluminum Titanium or

tungsten so that electricity can pass

through the semiconductor well the chip

manufacturing processes are now coming

toward completion

the next step is EDS this is the process

of testing to ensure Flawless

semiconductor chips in other words it is

a testing step to sort out defective

chips yield is a percentage of prime

chips relative to the maximum chip count

on a single wafer the semiconductor chip

selected through the Eds process are

made in a form suitable for devices

this is the last process the packaging

process

the wafer completed through the previous

steps are cut into individual

semiconductor chips that can be loaded

on an electronic device

an individual chip must have a path to

exchange electrical signals with the

outside and have a form to protect it

from various external elements the wafer

is cut into individual chips and the

diced or sawed chips are placed on the

PCB board in the bonding step the

contact point of the semiconductor chip

placed on a substrate is connected with

the contact point of the substrate then

molding finishes the chip package to its

desired shape after sealing the

semiconductor and labeling the product

name the semiconductor chip we commonly

see is completed of course only after

going through the final test will it

become a finished product

foreign

we learned about the essential processes

that produce semiconductor chips these

complex processes can be separated into

the pre-process up to the wafer

processing stage and the post process

which contains the testing and packaging

processes

we hope you now have a better

understanding of how a semiconductor

chip is manufactured stay tuned for more

interesting semiconductor episodes if

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